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News  ›  GlobeNewswire Inc.

Trends in Semiconductor Assembly Packaging Equipment Market 2025-2035

GlobeNewswire Inc. Logo GlobeNewswire Inc. By Towards Packaging
Trends in Semiconductor Assembly Packaging Equipment Market 2025-2035

The global semiconductor assembly packaging equipment market is expected to expand from USD 5.35 billion in 2026 to USD 11.11 billion by 2034, with an 8.45% CAGR. Growth is driven by demand for advanced electronics, miniaturization, and high-performance computing technologies.

Insights
PFE   neutral

Competing in Metsera acquisition but currently losing out to Novo Nordisk's offer


AMAT   positive

Strategically invested in BE Semiconductor Industries, signaling confidence in advanced packaging technologies and industry consolidation